Tegal
A plasma etcher removes selected material from a workpiece by using an energized plasma and controlled process chemistry to etch patterned areas.
Documented failure modes, common issues, and field considerations.
The i901 etch system was described as the debut sale of Tegal's next-generation diode plasma etcher on August 15, 2000.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The combination of directional ion bombardment and chemical etching in reactive ion etch systems allows for anisotropic etching, where material is removed faster in the vertical direction than laterally, producing steep sidewall profiles.
Regular maintenance includes cleaning the chamber to remove deposition buildup, replacing consumable parts such as electrodes or focus rings, and calibrating gas flow controllers and RF power delivery to maintain process repeatability.
Operators must follow protocols for handling toxic and corrosive process gases, ensure proper grounding for RF energy, and use vacuum safety interlocks to prevent exposure to plasma or high voltages.
The following facts about the 90 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 90 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 90 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 90 X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 90 X are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 90 X are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 13, 2026.
The SPTS / STS CPX Pegasus is an etcher with 8-inch wafer support and a two-chamber configuration.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.