Comparison ledger
Tegal 110, Tegal i90X, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | i90XTegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | Windows NT |
| Generation | — | — |
| Family | Tegal 110 | Tegal i90X |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| Technology | — | plasma etch technology[3] |
| Platform | — | based on the robust, production-proven platform of the 900 series[3] |
| Footprint | — | no increase in footprint[3] |
| Recipes | — | unlimited recipes[3] |
| Recipe editor | — | easy to use screen recipe editor[3] |
| Stabilization step | — | configurable, faster stabilization step[3] |
| Overetch step | — | programmable percent overetch step[3] |
| Set-point control | — | 20X fine set-point control for pressure, RF and gas flows[3] |
| Transport | — | improved, smooth, faster transport[3] |
| Stepper motors | — | high-resolution stepper motors[3] |
| Motor drivers | — | intelligent micro-stepping motor drivers[3] |
| Data logging | — | default or user-defined values and polling rates; downloadable files to disk or CD; on-screen real time and historical trending; unlimited access to every system I/O data point; additional I/O available for expansion[3] |
| User interface | — | GUI touch screen human interface; on-screen end-point trace; I/O screen read-out; on-screen alarm logging; lot and wafer ID[3] |
| Control system | — | programmed logic controller (PLC) for input/output speed and expansion; interface board connects to all existing sensors for troubleshooting and maintenance[3] |
| Control computer | — | Windows NT, Pentium II 130MB RAM, 230 MHz clock, 6GB hard drive available[3] |
| Integrated PC | — | industrial strength integrated PC/touchscreen[3] |
| Removable media | — | read-write CD and 3.5 floppy disk[3] |
| Process steps | — | Configurable, faster stabilization step; programmable percent overetch step[3] |
| Wafer transport | — | High-resolution stepper motors; intelligent micro-stepping motor drivers[3] |
| I/O control | — | Programmable logic controller (PLC) for I/O speed and expansion; interface board connects to all existing sensors[3] |
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