Waferpedia

Tool family

Kulicke & Soffa Rapid Pro Automatic

Models in this family

  1. The K&S Rapid Pro Automatic Wire Bonder is an automatic ball bonder from the GEN-S series designed for high-performance semiconductor packaging with real-time monitoring and diagnostics.

    Cited variants

    DesignationGenerationVintageChangesSource
    RAPID Pro LA——Large Area bonding: Y axis 87 mmscribd.com[1]
    RAPID Pro ELA——Extended Large Area bonding: Y axis 80 mmscribd.com[1]
    RAPID Pro LA (Large Area)——Large area bondable area configurationzaratech.biz[2]
    RAPID Pro ELA (Extended Large Area)——Extended large area bondable area configurationzaratech.biz[2]

Sources

Sources (2)Every fact above is drawn from these public sources
  1. [1]scribd.comscribd.com
  2. [2]zaratech.bizzaratech.biz