STS ICP

Models in this family

1. 

   ICP

   STS ICP is an etch tool class used for plasma-based material removal and surface pattern transfer. It belongs to the category of inductively coupled plasma etch systems used in semiconductor and related microfabrication work.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   STS ASE ICP DRIE – Fluorine	ICP	—	Load-locked inductively coupled plasma etch system for deep silicon etching using the Bosch process; uses SF6, C4F8, O2, and Ar.	cores.research.asu.edu[1]
   STS Multiplex ICP	ICP	—	ICP plasma etcher for 100 mm wafers using chlorine and bromine chemistry; used for metals etching, deep polymer etching, and Si, SiO2, and Si3N4 thin films etching.	epfl.ch[2]

Sources