Accretech
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The A WD 100 M is an automatic dicing saw manufactured by Accretech/TSK.[1]
An automatic dicing saw uses a rotating spindle mounted with a thin diamond-impregnated blade to cut along streets (scribe lines) between die on a wafer.
The wafer is typically mounted on a dicing tape stretched over a metal frame. The machine automatically aligns the wafer using pattern recognition, then cuts to a controlled depth, often leaving the tape intact to hold the die. A water spray cools the blade and removes debris.
After dicing, the individual die are picked from the tape and proceed to die attach, wire bonding, and encapsulation. The saw is a critical step in singulation before packaging.
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The following facts about the A WD 100 M Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the A WD 100 M Automatic Dicing are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the A WD 100 M Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the A WD 100 M Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the A WD 100 M Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the A WD 100 M Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 1, 2026.