Dicing & Grinding

The Buehler Isomet 4000 is a precision linear sectioning saw.

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.

The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.

The Disco DAD 3350 is an automatic dicing saw.

The Disco DAG810 is a compact automatic surface grinder used for thinning silicon, III/V materials, glass types, wafers, stacked wafers, and chips.

The Disco DFG 8540 Back Grinder is a fully automatic grinder for wafer thinning. The Disco DFG 8540 Back Grinder supports 8 inch wafers with a universal chuck table and uses anomalous in-feed grinding with wafer rotation.

The Blanchard No. II Rotary Grinder is a rotary grinder manufactured by Blanchard.

The Disco 841 (DFG 841) is a back grinder for semiconductor wafers, handling sizes from 4 to 8 inches with two-spindle, two-chuck table configuration.

The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.

The Disco DFL 7361 is a laser saw with a Type FX laser head, BSS-6 optics system, and integrated wafer cleaning system with atomizing nozzle.

The Logitech APD1 is a combined annular and peripheral precision saw for slicing wafers, crystals, semiconductor components, and other materials with minimal kerf loss and surface damage.

The Disco DFD 6362 is an automatic dicing saw for semiconductor wafer singulation, supporting 8-inch wafers.

The Accretech / TSK A WD 200 T is an automatic dicing saw.

The Disco DFD 6362 Automatic Dicing is an automatic dicing saw.

The Disco DFD 8540 is a grinder manufactured by Disco.

The Takatori MWS 610 is a wire saw for dicing and grinding.

The Disco DFL 7340 Fully Automatic is a fully automatic laser saw.

The Disco DFD 650 is a fully automatic dicing saw with vintage years 1994, 1995, and 1997.

The Disco DFD 641 is a fully automatic dicing saw offered by Disco, with stated unit vintages of 1998, 1999, 2002, 2003, and 2005.

The Disco DFD 640 is a fully automatic dicing saw for cutting/slotting various wafers.

The Disco DFD 6341 is a fully automatic dual spindle dicing saw designed for Φ8-inch wafers, offering X-axis return speeds up to 1,000 mm/s.

The Disco DAD 552 is an automatic dicing saw.

The K&S 982-6 is a wafer dicing saw manufactured by Kulicke & Soffa.

The Accretech / TSK A WD 5000 A is an automatic dicing saw with known vintages of 2000 and 2003.

The Accretech / TSK A WD 110 A is an automatic dicing saw with vintage years 2006 and 2007.

The Accretech AD 2000 S is an automatic dicing saw.

The Disco DFD 6361 is an automatic dicing saw.

The Strasbaugh 70 R Edge is a 3-phase, 208-volt edge grinder used in semiconductor dicing and grinding.

The Kulicke & Soffa 7100 AD is a wafer dicing saw with electrical specifications of 200-240 VAC, 50/60 Hz, 15 Amps, and 3500 VA.

The Disco DFD 641 is an automatic dicing saw.

The Takatori MWS 610 SD is a wire saw for dicing applications, introduced in 2017.

The Kulicke & Soffa 7100 is a wafer dicing saw for semiconductor singulation.

Disco dicing saw handles up to 8 inch substrates and is used for dicing silicon, bonded Si wafers, and glasses.

The Disco DFD 6361 is a fully automatic dicing saw designed for 300 mm wafers, featuring a facing dual-spindle design and Synchro Spindle for consistent cut quality.

The Disco DAD 3220 is an automatic dicing saw with source-stated configurations including a 1.5 kW spindle, a 1000 watt spindle, and a 40,000 min spindle revolutions specification.

The Disco DAD 3230 is an automatic dicing saw.

The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.

The Disco DAD3220 is an automatic dicing saw designed for compactness and compatibility with 6-inch wafers and 6x6-inch workpieces.

The Kulicke & Soffa 984 6 is a dicing saw specified with 50/60 Hz operation, 208 VAC line voltage, 3100 VA power, and 15 A current.

The Strasbaugh 7 AA SP is a grinder in the Dicing & Grinding category.

The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.

The Disco DAD321 is an automatic dicing saw for silicon, glass, and pyrex wafers, with support for 100 mm and 150 mm wafers.

The Kulicke & Soffa 782-6 is a dicing saw that handles wafers up to 6 inches and up to 800 µm thick, and dices Si, Glass, Quartz, SiC, Sapphire, and LiNbO3 with kerf widths down to 50 µm.

The Disco DFG 850 is a back grinder for semiconductor wafer thinning.

The Accretech / TSK W GM 4200 E is an edge grinder with wafer sizes stated as 2 inch and 6 inch.

The Disco DFD 6340 is a fully automatic dicing saw designed for 8-inch wafers.

The Disco DAD 322 is an automatic dicing saw for cutting semiconductor wafers.

The Disco DFG 840 is an automatic in-feed surface grinder for semiconductor wafer thinning, handling wafers from 4 to 8 inches.

The ADT 7100 ProFortis is a dicing saw manufactured by Advanced Dicing Technologies (ADT), designed for singulation of semiconductor and microelectronic components.

The Disco DAD 522 is an automatic dicing saw.

Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.

The Accretech AD 20 T is a dicing saw used for semiconductor wafer dicing.

The IsoMet 1000 Precision Saw is a fully enclosed, precision sectioning saw designed for cutting various types of material with minimal deformation, using blades ranging from 4–7 inches [102–178mm].

The Disco DAD 651 is an automatic dicing saw used in semiconductor manufacturing.

Strasbaugh 7 AA Back is a back grinder used in semiconductor dicing and grinding.