Dicing & Grinding

The Disco DAD641 is an automatic dicing saw used for wafer dicing operations.

The Disco DAD3241 is a high-productivity automatic dicing saw that supports large workpieces up to Φ8”.

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Disco DAD 522 is an automatic dicing saw.

The Disco DFD 6340 is a fully automatic dicing saw designed for 8-inch wafers.

The Blanchard No. II Rotary Grinder is a rotary grinder manufactured by Blanchard.

The Disco DAD 2 H / 6 is an automatic dicing saw.

The Disco 841 (DFG 841) is a back grinder for semiconductor wafers, handling sizes from 4 to 8 inches with two-spindle, two-chuck table configuration.

The Disco DFD 8540 is a grinder manufactured by Disco.

The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.

The Disco DAD 651 is an automatic dicing saw used in semiconductor manufacturing.

The Disco DAD3221 is an automatic dicing saw for 100 mm and 150 mm wafers.

General referenceDisco Dicing is a dicing and grinding machine used to separate processed substrates and shape their edges or thickness as part of precision singulation work. It belongs to a class of equipment used in back-end semiconductor and precision substrate processing.

The Disco DFD 641 is an automatic dicing saw.

The Disco DFD6240 is a fully automatic single-spindle dicing saw for 200 mm wafers, designed for dicing silicon and compound semiconductors and for cutting and grooving ceramics, glasses, and other materials.

The Disco DAD 322 is an automatic dicing saw for cutting semiconductor wafers.

The Accretech / TSK A WD 250 S is an automatic dicing saw.

The Accretech / TSK A WD 100 M is an automatic dicing saw with vintage years 2000 and 2003.

Disco DFD 651 is an automatic dicing saw used for semiconductor wafer dicing.

The Accretech / TSK PG 300 RM is a back grinder.

The Buehler Isomet 4000 is a precision linear sectioning saw.

The Disco DAD 3350 is an automatic dicing saw.