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ADT

7100 Dicing

Dicing & GrindingADT 7100 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The ADT 7100 Dicing Saw is an automated dicing saw with a precision dicing and alignment system. The ADT 7100 Dicing Saw has a 2-inch DC-brushless, 1.2 kW, front-mounted, air-bearing spindle. The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight-tolerance products up to 200 mm x 200 mm.[1][2]

7100 Dicing — Inventory photo
Fig. 017100 DicingInventory photo[3]

What it is

The ADT 7100 is a dicing saw made by ADT. The ADT 7100 is used to separate die from a wafer by cutting or scribing lines in the x and y direction.[6][3][7]

How it works

The ADT 7100 uses a specified blade selected according to substrate type to cut or scribe the wafer. The ADT 7100 user interface includes recipe parameters such as cutting speed, depth, street, index, and blade information. The ADT 7100 procedure includes system initialization, recipe assignment, blade change functions, wafer loading, alignment, and cut position definition.[7][8]

The ADT 7100 has a precision dicing and alignment system. The ADT 7100 is an automated tool with a DC brushless front mounted air bearing spindle, a closed loop turntable, and optimization for multi angle dicing of thin tight tolerance products up to 200 mm x 200 mm. The ADT 7100 has a maximum substrate size of 8 inch.[2][1]

Where it fits in the process flow

General reference — not yet source-verified

Dicing saws are used after wafer fabrication and after any thinning or backside preparation needed before singulation. Dicing saws hand off individual die or diced substrate pieces to downstream assembly, packaging, inspection, or device level handling steps.

Applications

The ADT 7100 is used for dicing of silicon wafers, glass wafers, and sapphire wafers. The ADT 7100 can use blades for glass and hard materials as well as a blade used only to cut silicon and softer materials.[1][7]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Main cause of broken blades is having the saw descend directly onto the sample.

What do the numbers mean?

Power & electrical1

Spindle
2-inch, DC-brushless, 1.2 kW, front-mounted, air-bearing spindle[1]
Accurate?

Wafer handling1

Maximum substrate size
8 inch[2]
Accurate?

Configuration & options7

UPS for the machine[3]
Accurate?
Spare parts / additional tooling[3]
Accurate?
Tool manufacturer
Advanced Dicing Technologies (ADT)[1]
Accurate?
Tool model
7122 NEMO[1]
Accurate?
Maximum spindle speed
60 krpm max.[1]
Accurate?
Turntable
Closed-loop turntable[1]
Accurate?
Maximum product size
Up to 200 mm x 200 mm[1]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Spindle2-inch, DC-brushless, 1.2 kW, front-mounted, air-bearing spindle[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What does the ADT 7100 do?

The ADT 7100 is used to separate die from the wafer. The ADT 7100 uses a specified blade to cut or scribe lines in the x and y direction.[7]

Not publicly documented

The following facts about the 7100 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7100 Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7100 Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7100 Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 7100 Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 7100 Dicing are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]wiki.nano.upenn.edu — wiki.nano.upenn.eduwiki.nano.upenn.edu
  2. [2]nnci.net — nnci.netnnci.net
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing
  7. [7]http://ssel-sched.eecs.umich.edu/ToolDocs/doc00107.pdf — ssel-sched.eecs.umich.edussel-sched.eecs.umich.edu
  8. [8]ADT 7100 - Initial Setup Before Cutting - UCSB Nanofab Wiki — wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
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Last updated Oct 19, 2026.

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