Waferpedia

Datacon

8800

RFID chip attach equipmentDatacon 8800 family
Research Quality: 40% complete
LinkedIn X Email
8800 — web.archive.org
Fig. 018800web.archive.org[1]

  • Plate 01Besi die bonder datacon 8800 series Semiconductor Equipment die bonding machine #diebonder

    GEEKVALUE SMT SolutionsWatch on YouTube

  • Plate 02Datacon 8800 series Besi datacon die bonder machine #diebonder #semiconductorequipment

    GEEKVALUE SMT SolutionsWatch on YouTube

What is it?

The 8800 FC Smart Line is described as a complete reel-to-reel production solution for RFID chip attach, supporting both direct chip attach and indirect chip attach. The source states that it is based on the 8800 FC Quantum flip chip bonder and includes integrated dispensing, post-dispense and post-bond inspection, a heated press, spooler system, and wafer mapping according to SEMI standard with ALPS conversion licence.

What can it run?

Process applications and technology nodes documented for this tool.

  • RFID direct chip attach
  • RFID indirect chip attach

What do the numbers mean?

Wafer handling4

Assembly systems
Two independent assembly systems with two flip units picking dies from one wafer, two bond heads, two dipping units, and two substrate and upward looking camera systems[1]
Accurate?
Wafer magazines
25 slot SEMI standard wafer magazines[1]
Accurate?
Substrate width
Endless substrate, up to 15" width[1]
Accurate?
Wafer mapping
According to SEMI standard with ALPS conversion licence[1]
Accurate?

Performance2

Throughput
Up to 10,000 UPH[1]
Accurate?
Placement accuracy
40 µm @ 3s[1]
Accurate?

Configuration & options8

Chip attach modes
Direct and indirect chip attach (both strap and antenna web)[1]
Accurate?
Interconnection technologies
NCP, ACP, soldering (C4, GBS)[1]
Accurate?
Production format
Complete equipment solution based on reel to reel production[1]
Accurate?
Base bonder
8800 FC Quantum flip chip bonder[1]
Accurate?
Functions
Dispense and fluxing capability, flip chip pick & place, and inspection capability[1]
Accurate?
Integrated dispensing
High speed dot or volumetric dispensing[1]
Accurate?
Inspection
Post dispense, post bond inspection[1]
Accurate?
Press
Thermo-controlled heated press / heated gang press[1]
Accurate?
Interested in this tool?
Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 8800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8800 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 8800 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 8800 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 8800 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 8800 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
Was this page accurate?

Last updated Jul 29, 2026.