2 entries
- 2200Datacon
Datacon 2200 apm is a multi chip die bonder described as the current industry standard and based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform.
CategoryPackaging & Bonding - 8800Datacon
Datacon 8800 FC Smart Line RFID is a reel-to-reel RFID chip attach equipment solution for direct and indirect chip attach, built around the 8800 FC Quantum flip chip bonder.
CategoryRFID chip attach equipment
