Waferpedia

ESI

3511

Microwave Downstream Plasma Asher100mmESI 3511 family
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ESI3511
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Wafer size

100mm

Gas delivery

Oxygen, forming gas[1]

What is it?

The ESI 3511 is listed as a microwave downstream plasma asher. The source states it is a cassette loader system for 100 mm wafers only, using oxygen and forming gas chemistry, with a heated plate up to 300°C, and that it is a microelectronic compatible equipment for high-rate polymer ashing on the wafer topside only.

What can it run?

Process applications and technology nodes documented for this tool.

  • High rate polymer ashing
  • Wafer topside ashing
  • Wafer surface cleaning before subsequent processes

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Quickstick not allowed

What do the numbers mean?

Wafer handling3

Load mode
Cassette loader[1]
Accurate?
Wafer size
100mm wafers ONLY[1]
Accurate?
Application
High rate polymer ashing (wafer topside ONLY)[1]
Accurate?

Gas & chemistry1

Chemistry
Oxygen, forming gas[1]
Accurate?

Configuration & options5

Tool type
Microwave Downstream Plasma Asher[1]
Accurate?
Compatibility
Microelectronic compatible equipment[1]
Accurate?
Heated plate temperature
Up to 300°C[1]
Accurate?
Constraint
Quickstick not allowed[1]
Accurate?
Location
Zone 1[1]
Accurate?
Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ChemistryOxygen, forming gas[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 3511 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3511 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 3511 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 3511 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 3511 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 3511 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]epfl.ch — epfl.chepfl.ch
  2. [2]Tepla 300 ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
  3. [3]Jelight UVO Cleaner ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
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Last updated Jul 29, 2026.