100mm

The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.

The Logitech PM5 is a polishing and lapping machine used for sample preparation.

The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.

The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.

Tokyo Electron Clean Track ACT-8 is an industry-standard wafer coater and developer used in a DUV lithography cluster with an in-line exposure unit interface.

Heidelberg Instruments VPG200 is a laser pattern generator used for mask production, direct exposure on SEMI-standard wafers, and mask reticles.

The Temescal FC-2000 is a load-locked bell jar deposition system for small-scale production and R&D, with listed substrate fixtures for 2-inch, 3-inch, 100-mm, and 150-mm wafers.

The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.

The SUSS MicroTec MJB4 is a manual mask/wafer aligner for research and development that aligns and exposes wafers up to 4 inch (100 mm) diameter.

The GCA 6100 C Wafer Stepper is a lithography tool for 100 mm wafers with a 150 mm X/Y stage travel and an AWH1 automatic wafer handler.

The Disco DAD321 is an automatic dicing saw for silicon, glass, and pyrex wafers, with support for 100 mm and 150 mm wafers.

The ESI 3511 is a microwave downstream plasma asher used for high-rate polymer ashing and wafer backside cleaning on 100 mm wafers.

The PlasmaLab M80 Plus – Chlorine is an open load reactive ion etch system for etching compound semiconductors and metals.

The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.

TEL Unity Me is an automatic plasma etching production tool from Tokyo Electron, configured at CMi with a 100mm wafer cassette loader, a transfer chamber, and a DRM process module.

The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.

The Tegal 900 is a plasma etch system used for applications including defreckling, backside nitride etching, and processing III-V materials.

EP1 is a Logitech chemical mechanical polishing cloth and pad product suitable for a wide range of applications, including oxide, nitride, and copper.

The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.

The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.

The OAI 808 Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with stated alignment accuracy of 1µm to 2µm.

Oxford PlasmaPro100 is an ICP plasma etcher for 100mm wafers used for chlorine and bromine chemistry.

The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.

The OAI Model 800 Mask Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with motorized backside focus, motorized auto leveling, and auto gap setting.

The Pfeiffer ATH1603M is a magnetically levitated turbomolecular pump used for high vacuum applications.

The Signatone S-302-4 is a four point resistivity probe station used for sheet resistance and resistivity measurements of substrates and thin films.

The Karl Suss MA-4 is a contact/proximity mask aligner used for substrates up to 4" (100mm) in diameter.

ASML PAS 5500/300 is a deep-UV stepper photolithography tool configured for 4-inch wafers.

The Logitech APD1 is a combined annular and peripheral precision saw for slicing wafers, crystals, semiconductor components, and other materials with minimal kerf loss and surface damage.

The Tegal 915 is a plasma barrel etcher with batch capacity for 100 mm, 125 mm, and 150 mm wafers.