Bondjet BJ 815

The Hesse & Knipps Bondjet BJ 815 is a packaging and bonding machine used in semiconductor assembly for making electrical interconnections between a die and its package or substrate.

It belongs to the wire-bonding class of equipment, which is used to create fine interconnects in microelectronic packages after a device has been fabricated and prepared for assembly.

A wire bonder places and bonds very fine metal wire between bond pads on the device and corresponding pads or leads on the package. The machine typically uses a capillary or similar bonding tool to form each connection with controlled pressure, heat, and motion.

In this equipment class, the bonding sequence is repeated pad by pad under motion control, with the bonding head and work holder positioned to produce a series of electrical connections across the device.

Wire bonding sits in the back-end assembly flow after wafer fabrication, dicing, and die attach. It links the completed die to the package structure so the device can be sealed and tested as a packaged component.

Downstream of bonding, the assembly typically proceeds to encapsulation or other package finishing steps, followed by electrical test and final inspection.

This class of machine is used for semiconductor packaging, module assembly, and other microelectronic interconnect tasks where small bond features are required.

It is used with packaged integrated circuits and similar devices that need fine-pitch electrical connection between the die and the external package or carrier.