BJ 820

Wire bonders are packaging tools that create electrical interconnects between a semiconductor die or device and its package or substrate by forming fine wire connections. Wire bonders are used after die attach and before later package completion and final test.

Ultrasonic thin-wire bonders form interconnects by pressing a tool against bond pads while ultrasonic energy and force create a metallurgical bond. Ultrasonic wire bonding generally relies on precise motion control, optical alignment, loop shaping, and process monitoring to place successive wire connections across a device.

Wire bonding sits in semiconductor assembly after a die has been attached to a package, leadframe, substrate, or similar carrier. Wire bonding is followed by downstream packaging steps such as encapsulation, lid attach, singulation, and electrical test, depending on the package flow.

Thin-wire bonders are used for semiconductor and microelectronic packaging tasks that require fine conductive links from device bond pads to package terminals or substrate traces. Thin-wire bonding is common where delicate pad structures, compact layouts, and controlled loop geometry are important.