KE 2080 L

The Juki KE 2080 L is a pick-and-place machine in the Assembly / SMT equipment category. The Juki KE 2080 L is configured with a TR5 tray server. The Juki KE 2080 L operates on 50/60 Hz, three-phase power.^[1][2][3]

A pick-and-place machine holds the printed circuit board stationary on a conveyor and moving rail system while the placement head travels above it in the horizontal plane. The placement head descends to the feeder pickup position, where a nozzle draws a component against its tip under vacuum, then rises and travels to the programmed placement coordinate. A downward stroke presses the component into the solder paste deposit on the board pads, and the nozzle releases the component by breaking the vacuum.

A vision system on a pick-and-place machine photographs the component while the head is in flight or at a fixed alignment camera station. The vision system measures the offset and rotation of the part relative to the nozzle and passes a correction to the motion controller, which compensates the placement position. Nozzle changers allow a machine to exchange tips of different size so that a single head can handle a range of component body sizes.

Placement occupies the step after solder paste has been printed onto the board pads and before the assembly enters a reflow oven. Solder paste printing establishes the deposit that will hold each component in position and form the joint, so placement accuracy is gauged against those deposits. Reflow soldering follows placement and forms the permanent electrical and mechanical connections.

A surface-mount line places components in sequence, and pick-and-place machines are commonly arranged so that high-speed heads handle small chip components while other heads in the same line handle larger or finer-pitch devices. Inspection steps such as automated optical inspection follow reflow to verify solder joints and component presence. Rework and repair stations then address any joints or placements that fail inspection.

Pick-and-place machines are used across surface-mount assembly of printed circuit boards, including boards for computing, communications, instrumentation, automotive electronics, and industrial control. Placement equipment handles chip resistors and capacitors, integrated circuit packages, connectors, and other leaded or leadless surface-mount devices. Tray-fed placement of larger devices such as area-array packages and modules is a common use of a machine equipped with a tray server.

The placement step determines the positional accuracy of every component on the board and therefore influences solder joint quality and electrical yield. Mixed-technology boards that carry both surface-mount and through-hole parts typically pass through placement for the surface-mount portion before the through-hole operations. Prototype and low-volume production runs also use pick-and-place machines when the board mix requires programmable, quick-change placement rather than fixed tooling.