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Wire bonders are semiconductor packaging tools that create electrical interconnects between a device and its package or substrate using fine wire. Packaging and bonding equipment belongs to the back end of semiconductor manufacturing, after device fabrication on the wafer is complete.

Wire ball bonders form a small ball at the end of a bonding wire and attach that wire between bond pads and package leads or substrate features. Wire bonding systems generally combine precise workholding, tool motion, bond force control, heat, and ultrasonic energy to make repeatable metallurgical and mechanical connections.

Wire bonders are used after singulation or die preparation and die attach, when a semiconductor device must be electrically connected into its package or assembly. Packaging and bonding tools sit downstream of front end wafer processing and upstream of encapsulation, sealing, final electrical test, and shipment preparation.

Wire ball bonders are used for semiconductor packages and related microelectronic assemblies that require fine wire interconnection from the die to the package or substrate. Packaging and bonding tools in this class are applied where compact pad layouts and delicate interconnect geometry call for controlled placement of bonding wire.