Waferpedia

Kulicke & Soffa

982-6

Dicing & GrindingKulicke & Soffa 982-6 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

982-6 — Inventory photo
Fig. 01982-6Inventory photo[1]

What it is

General reference — not yet source-verified

The Kulicke & Soffa 982-6 is a wafer dicing saw used in semiconductor manufacturing to singulate individual die from a processed wafer.

How it works

General reference — not yet source-verified

A wafer dicing saw uses a high-speed rotating diamond-impregnated blade to cut along the scribe lines of a wafer, separating it into individual chips.

The blade is mounted on an air-bearing spindle and is cooled by deionized water to prevent thermal damage and to flush away debris.

Where it fits in the process flow

General reference — not yet source-verified

Dicing saws are used in the back-end assembly process, after wafer fabrication and electrical test, to separate the wafer into individual die.

Singulation is followed by die attach, wire bonding or flip-chip bonding, and encapsulation.

Applications

General reference — not yet source-verified

Wafer dicing saws are used to cut silicon wafers as well as wafers made from compound semiconductors such as gallium arsenide, silicon carbide, and other materials used in microelectronics and optoelectronics.

What do the numbers mean?

Power & electrical2

Voltage
208 VAC[1]
Accurate?
Frequency
50/60 Hz[1]
Accurate?

Configuration & options2

Current
15 A[1]
Accurate?
Power
3100 VA[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage208 VAC[1]
  • Frequency50/60 Hz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 982-6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 982-6 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 982-6 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 982-6 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 982-6 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 982-6 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Sep 23, 2026.

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