Kulicke & Soffa
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Kulicke & Soffa IConn ProCu is a wire bonder used in semiconductor packaging and assembly. It makes an electrical connection between a chip and a substrate using gold or copper wire.[2]
It is a fully automatic wire bonder. The equipment is placed in packaging assembly and wirebond assembly workflows.[2]
In this model, copper wire operation is supported, and the equipment is intended for ball-grid-array product work with very fine pad spacing. It also supports wire pull and ball shear use for process development and control.[2]
The equipment is used for gold or copper wire bonding in semiconductor packaging, including ultra-fine pitch ball-grid-array products.[2]
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| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| IConn ProCu PLUS LA | — | — | — | c2mi.ca[2] |
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It is a fully automatic wire bonder for semiconductor packaging assembly.[2]
It can make the electrical connection with gold wire or copper wire.[2]
Yes. Copper wire operation is supported with forming gas.[2]
The following facts about the IConn ProCu are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the IConn ProCu are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IConn ProCu are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the IConn ProCu are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IConn ProCu are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IConn ProCu is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
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