Max Ultra

Wire bonders are packaging tools that create electrical interconnects between a semiconductor die and a package lead, substrate, or other connection point using fine wire. Wire bonding is a standard assembly step after die attach and before final encapsulation or package completion.

Wire bonders generally position a semiconductor device under a bonding head, form a bond at one connection point, loop wire to a second connection point, and complete the interconnect by making a second bond. Wire bonding systems commonly combine precision motion, bonding force control, ultrasonic energy or heat depending on bond method, and optical alignment to place bonds on small metallized features.

Wire bonders operate in the semiconductor assembly and packaging flow rather than in front end wafer fabrication. The wire bonding step typically follows die placement onto a package or substrate and precedes encapsulation, lid attach, singulation, marking, and final test, depending on package style.

Wire bonders are used to interconnect integrated circuits and other microelectronic devices inside packages. Wire bonding is applied across many package types where a die must be electrically connected to leads, pads, or substrate traces for signal and power routing.