CMP

The Buehler Ecomet 3000 is a variable speed grinder/polisher with an 8-inch aluminum platen and speed range from 10 to 500 rpm.

The Logitech 1 DP 41 is a polisher with 3-phase, 50/60 Hz, 480 V, 12 amp electrical requirements.

The Strasbaugh Model 6DF is a tool manufactured in 2016 with a 22-inch capacity.

The GigaMat 3806 L is a polisher with a water jet and 480 VAC, 60 Hz power specification.

The Applied Materials Reflexion LK Prime is a CMP (Chemical Mechanical Polisher) system.

The Buehler Ecomet 3 is a grinder/polisher.

The Logitech IPLE 4 - 0700 is a lapper polisher plate with a 35 cm plate.

The Applied Materials Reflexions CMP 3600 is a chemical mechanical polisher (CMP) for 12-inch wafers.

The Kawasaki 3 NS 411 B F 006 Atmospheric Wafer Robot is an atmospheric wafer robot used for CMP applications.

The Applied Materials Mirra Mesa CMP 5201 is a CMP polisher for 8-inch wafers with oxide, dry-in/dry-out configuration.

The PR Hoffman 2400 is a lapping and polishing machine used in semiconductor manufacturing, categorized under CMP (Chemical Mechanical Planarization).

The Lam / IPEC AvantGaard 776 Tungsten is an 8-inch tungsten CMP (chemical mechanical polisher).

The Lam Research IPEC 372 M is a chemical mechanical polisher (CMP) for 8-inch (200 mm) wafers, also known as the IPEC 372M Avanti automated wafer polishing system.

The Logitech DH 300 is a polisher categorized as CMP, and no detailed specifications for the Logitech DH 300 are currently documented.

The GigaMat 3828-46 is a chemical mechanical polisher (CMP).

The Lapmaster 96 Continuous Polisher is a polishing machine that requires a 3-phase, 60 Hz, 460 V, 80 A electrical supply.

The Strasbaugh 6 DE DC 6 is a six-spindle polisher with a 12-inch capacity.

The Strasbaugh 6 CA is a polisher used in semiconductor manufacturing.

The Applied Materials Reflexion 3600 is a CMP (Chemical Mechanical Polisher).

The Strasbaugh 6 DE DC 4 is a polisher categorized under CMP.

The Alpsitec E 460 CMP tool is a semi-automatic system for polishing and planarizing wafers.

The Disco F DFP 8160 Fully Automated Polisher is a fully automated polisher for 8-inch to 12-inch wafers.

The Strasbaugh 6 SD SYU is a CMP polisher introduced in 1991.

The Strasbaugh 6 AN is a chemical mechanical planarization (CMP) polisher.

The Strasbaugh R 6 Y is a polisher manufactured by Strasbaugh.

The Strasbaugh 7 AF, also known as the nTellect 7AF, is a backgrinder for semiconductor wafer thinning that supports tapeless backgrinding for bumped and non-bumped wafers.

General referenceThe Strasbaugh 6 Y 1 is a chemical mechanical planarization (CMP) system, a class of machine used to polish and planarize semiconductor wafers during integrated circuit fabrication.

The Strasbaugh 6 U 15 R is a polisher described as a four-spindle, single 16-inch unit.

The Lapmaster 12 Lapper is a lapping and polishing machine categorized under CMP, with a 12-inch outside plate diameter.

The Struers Lab Force 1 is a grinder and polisher categorized as a CMP system.

The Buehler MetaServe 2000 is a grinder/polisher categorized under CMP.

The Rorze RR 700 L 150 Z 30 is a 6-inch single-arm tool compatible with AMAT Mirra Mesa CMP.

The Strasbaugh 6 J is a grinder/polisher in the CMP category.

The Lam OnTrak Synergy Post is a CMP cleaner described as an 8-inch post-CMP cleaner with a HEPA mini-environment.

The Strasbaugh 6 DA 2 is a CMP polisher.

The Strasbaugh 6 CW Wafer is a wafer polisher categorized under CMP.

The Allied High Tech MetPrep 4 is a microprocessor-controlled grinding and polishing machine for semiautomatic sample preparation, programmable for up to 25 steps and combinable with PH-4 or PH-6 power heads.

The Strasbaugh 6 DF-1 is a polisher with one spindle and 22-inch capacity.

The Lam / IPEC AvantGaard 776 is an 8-inch chemical mechanical polisher (CMP) available in dielectric and tungsten configurations.

The Lam / IPEC Avanti 472 is a CMP (Chemical Mechanical Polisher) described as a fully automated single-wafer system for 4" to 8" wafers.

The Strasbaugh 7 AA Grinder Lapper is a grinder/lapper/polisher with wafer sizes from 2 inch to 6 inch.

The Accretech PG 300 RM Grinder Lapper is a grinder, lapper, and polisher in the CMP category.

The Logitech PM5 is a polishing and lapping machine used for sample preparation.

The Lam / IPEC 472 is a chemical mechanical planarization (CMP) tool.

The Disco DFS 8960 Surface Planarization is a fully automatic surface planarization system for 8-inch and 12-inch wafers.

Applied Materials Mirra Integra is a CMP (Chemical Mechanical Polisher) for 8-inch wafers.

The Strasbaugh 6 DE 4 Spindle is a CMP polisher configured with a 4 Bank Overarm arrangement.

The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.

The Disco DGP 8761 is a polishing machine used in semiconductor manufacturing.