M5

The MRSI M5 is an assembly work cell for advanced packaging assembly. The MRSI M5 is intended for complex epoxy die attach, eutectic bonding, and flip chip bonding. The MRSI M5 is aimed at semiconductor and electronic packaging work, including microwave modules, MEMS, advanced semiconductor packages, multi-chip modules, hybrid devices, and photonic packages.^[1]

The MRSI M5 uses a cast composite base for fast moves with virtually no settling time. The MRSI M5 uses brushless DC linear servo motors with linear glass-scale encoder feedback on the major axes. The MRSI M5 uses closed-loop force control for die placement and can place delicate gallium arsenide die with as little as 10 grams of force. The MRSI M5 also supports higher programmed forces for eutectic bonding with scrub and temperature control. The MRSI M5 operates on MRSI Systems Windows workcell software.^[1]

The MRSI M5 has an advanced vision system that supports full 360° die orientation. The MRSI M5 uses boundary trace or pattern match to locate die centers or critical features. The MRSI M5 uses dual magnification cameras through a single optical path to find and align die fiducials with no XY movement. The MRSI M5 uses programmable ring and collimated multi-color lighting for alignment on challenging surfaces. The MRSI M5 has a thirteen-position tool bank with automatic tool change.^[1]

The MRSI M5 picks die from waffle pack, Gel-Pak, wafer, and tape and reel. The MRSI M5 processes boats, custom trays, and lead frames. The MRSI M5 can operate as part of a fully integrated SMEMA production line or in a standalone mode. The MRSI M5 features automatic wafer change from cassette and handles two wafers simultaneously so that a new wafer can be loaded immediately upon unloading the finished wafer.^[1]

The MRSI M5 is used for epoxy die attach, eutectic bonding, and flip chip bonding. The MRSI M5 can be configured with epoxy dispense pumps and epoxy stamping for a complete assembly solution. The MRSI M5 can also be configured for UV epoxy dispense and in-situ cure for critical placement applications such as active optical connectors, CCD and diode arrays, and sensor applications.^[1]

The MRSI M5 includes eutectic bonding capability with a 1.5” x 3” hot plate reflow station. The MRSI M5 uses heated hydrogen and nitrogen cover gas over the hot plate during eutectic processing. The MRSI M5 can also be configured with a progressive heated boat indexer for higher eutectic throughput. The MRSI M5 supports flip chip placement with an uplooking camera and flux well. The MRSI M5 can create epoxy dots as small as 0.004” (100 microns) by stamping.^[1]