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MRSI

705

Packaging & BondingMRSI 705 family
Research Quality: 40% complete
705 — Inventory photo
Fig. 01705Inventory photo[1]

What it is

The MRSI 705 is a die bonder used in semiconductor packaging and bonding. It is a single-head, gripper-type machine with magazine-to-magazine handling, manual loading, and gelpak holder support.[1][2][3][4][8]

Applications

General reference — not yet source-verified

Equipment of this class is generally used for assembling discrete dies into packages, modules, and other packaged semiconductor forms where precise placement and bonding are required.

What do the numbers mean?

Configuration & options6

Magazine to Magazine[1]
Accurate?
4 Stage Ramp-up Heating[1]
Accurate?
Manual Loading Gelpak Holder[1]
Accurate?
Single Head[1]
Accurate?
Gripper Type[1]
Accurate?
High Bondforce Capable[1]
Accurate?
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What replaced it?

  • siblingMRSI M1The MRSI product navigation lists MRSI-M1 and MRSI-705 as related models within the same product family.source[6]
  • siblingMRSI M5Listed in the same product navigation as the M5.source[7]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

How many heads does the MRSI 705 have?

It is a single-head machine.[1][2][3][4][8]

Not publicly documented

The following facts about the 705 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 705 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 705 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 705 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 705 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 705 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (10)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Inventory photo
  6. [6]web.archive.orgweb.archive.org
  7. [7]web.archive.orgweb.archive.org
  8. [8]Equipment inventory listing
  9. [9]Equipment inventory listing
  10. [10]MRSI Systems受邀出席光收发器和硅基光电子论坛mrsisystems.com (Sep 15, 2021)web.archive.org
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Last updated Jul 29, 2026.

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