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Mydata

MY 12

Assembly / SMTMydata MY 12 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

MY 12 — Inventory photo
Fig. 01MY 12Inventory photo[1]

Power

50/60 Hz[1]

Performance

Repeatability of 15 mm at 3 sigma[4]

What it is

The Mydata MY 12 is an SMT pick-and-place machine used in electronic assembly. The Mydata MY 12 belongs to the MY-series family and is part of a placement system for populating printed circuit boards with components.[3]

How it works

General reference — not yet source-verified

Pick-and-place machines remove electronic components from feeders, tubes, trays, or other presentation formats, center or verify the parts with a vision system, and place them onto programmed locations on a printed circuit board. Pick-and-place machines are used to automate surface-mount assembly by combining part handling, positional alignment, and board transport in one platform.

Where it fits in the process flow

General reference — not yet source-verified

Pick-and-place machines sit in the surface-mount assembly flow after solder paste application and before thermal joining. Pick-and-place machines load components onto prepared printed circuit boards so the assemblies can proceed to reflow processing and later inspection or test.

Applications

The Mydata MY 12 is used for surface-mount assembly of printed circuit boards.[3]

What do the numbers mean?

Power & electrical5

50/60 Hz[1]
Accurate?
Power / electrical
50/60 Hz[3]
Accurate?
Hydra and Midas heads; conveyorized Z high speed; electrical two pole test; autoteach; electrical transistor test[4]
Accurate?
Power
50/60 Hz[3]
Accurate?
Installed options
Hydra and Midas Heads, Conveyorized Z High Speed, Electrical Two Pole Test, Autoteach, Electrical Transistor Test[4]
Accurate?

Performance3

Accuracy
Repeatability of 15 mm at 3 sigma[4]2 sources
Accurate?
Rated speed
21,000 CPH IPC 9850 chip net throughput 17,500 CPH[5]
Accurate?
Fine-pitch rated speed
6,100 CPH IPC 9850 fine pitch net throughput 1,500 CPH[5]
Accurate?

Control & software1

Control software
Linux-based TPSys system software[4]
Accurate?

Dimensions & facilities2

Machine size
3360 mm length, 1450 mm height, 2000 mm depth, 2134 mm depth, or 2378 mm depth depending on configuration[5]2 sources
Accurate?
Weight
2100 kg[5]2 sources
Accurate?

Configuration & options8

Type
pick and place machine[3]
Accurate?
Category
Assembly / SMT[3]
Accurate?
Placement rate, standard performance
6,500 CPH[4]2 sources
Accurate?
HYDRA Speedmount placement rate on chips
21,000 CPH[4]2 sources
Accurate?
Linescan Vision System placement rate on fine-pitch components
6,100 CPH[4]2 sources
Accurate?
Feeder capacity
144 x 8 mm tapes or 135 SOIC tubes or 112 x 8 mm tapes and 32 JEDEC trays (with TEX)[4]2 sources
Accurate?
Board handling: maximum board size
384 x 508 mm, 563 x 508 mm, 745 x 610 mm, or 932 x 732 mm depending on configuration[5]
Accurate?
Power requirements
Three phase AC 6.6 kVA (3 x 2.2 kVA)[5]2 sources
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50/60 Hz[1]
  • Power / electrical50/60 Hz[3]
  • ConfigurationHydra and Midas heads; conveyorized Z high speed; electrical two pole test; autoteach; electrical transistor test[4]
  • Power50/60 Hz[3]
  • Installed optionsHydra and Midas Heads, Conveyorized Z High Speed, Electrical Two Pole Test, Autoteach, Electrical Transistor Test[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Mydata MY 12?

The Mydata MY 12 is an SMT pick-and-place machine used in electronic assembly.[3]

Not publicly documented

The following facts about the MY 12 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MY 12 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the MY 12 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the MY 12 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MY 12 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MY 12 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
  4. [4]ibesmt.com — ibesmt.comibesmt.com
  5. [5]as-equipment.de — as-equipment.deas-equipment.de
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Last updated Oct 19, 2026.

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