Palomar

3880

Research Quality: 40% complete

Plate 01Palomar 3880-II Die Bonder
Palomar TechnologiesWatch on YouTube
Plate 02Palomar Technologies' 3880 Die Bonder Component Placement Die Attach System
Palomar TechnologiesWatch on YouTube

What is it?

The Palomar 3880 Die Bonder is described as a component placement die attach system with an integrated Z-Theta bidirectional 8-tool bond head. The source states that it supports eutectic and epoxy die attach, flip chip, and a range of options in a single machine, and it is listed among the die bonding equipment used in Palomar assembly services.

What can it run?

Process applications and technology nodes documented for this tool.

AOC - Active optical cable
Chip-on-board
HB/HP LED assembly
Microwave modules
RF packages
Hybrid microcircuits
MEMS / MOEMS
VCSEL, PD, DFB laser, lens attach
Solid state lasers
RF GaN 5G power amplifiers
LED printhead attachment
RF power amplifier
Optoelectronic/photonics packages

What do the numbers mean?

Wafer handling1

Machine use in services: Used for wafer (up to 12") deep access wafer sealing applications^[2]

Configuration & options4

Machine type: Component placement die attach system^[1]
Bond head: Integrated Z-Theta bidirectional 8-tool bond head^[1]
Capabilities: Supports eutectic and epoxy die attach, flip chip, and a range of options in a single machine^[1]
Process types listed: Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding, Thermocompression Die Bonding^[1]

Interested in this tool?

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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 3880 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3880 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3880 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3880 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3880 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3880 is not on record.
Answerable by: an OEM datasheet or a fab qualification report