Palomar

6500

Research Quality: 40% complete

Plate 016500 Die Bonder overview
Palomar TechnologiesWatch on YouTube
Plate 02Palomar 6500 High Precision Component Placement Die Bonder
Palomar TechnologiesWatch on YouTube
Plate 03Edge Emitting Laser Chip Epi-Side Down Flip Chip Eutectic Attach on 6500 Die Bonder
Palomar TechnologiesWatch on YouTube

What is it?

The Palomar 6500 Die Bonder is described as offering a balanced combination of accuracy, speed, and flexibility in a compact system footprint. It uses a four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame, and it is associated with die bonding processes including silver sintering, eutectic, epoxy, UV, and solder paste die bonding.

What can it run?

Process applications and technology nodes documented for this tool.

P-side down laser diode attachment
Silicon bench (V-Groove) placement
High-density RF power transistors
Ultra-fine pitch hybrid assemblies
MEMS components
VCSEL modules
Data storage
High-bright/high-power LED arrays
Optoelectronic packaging
LED printhead attachment
Solar concentrator packaging

What do the numbers mean?

Performance1

Placement capability: Ultra-high accuracy eutectic and adhesive placements^[1]2 sources

Configuration & options5

Machine type: Die bonder^[1]
Positioning system: Four-axis positioning system^[1]2 sources
Drive mechanism: Linear motors gliding over air bearings^[1]
Frame: Steel based frame^[1]2 sources
Cycle time: Under seven seconds^[1]2 sources

Interested in this tool?

Embed spec card

What replaced it?

siblingPalomar 6532HP— Listed as a next model in navigation alongside the 6532HP.source^[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 6500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6500 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6500 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6500 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6500 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (7)Every fact above is drawn from these public sources

[1]web.archive.org — web.archive.orgweb.archive.org
[2]web.archive.org — web.archive.orgweb.archive.org
[3]web.archive.org — web.archive.orgweb.archive.org
[4]web.archive.orgweb.archive.org
[5]6500 Die Bonder — palomartechnologies.compalomartechnologies.com
[6]6500 Die Bonder Data Sheet — palomartechnologies.compalomartechnologies.com
[7]PALOMAR 6500 - Palomar Technologies, Inc | Die Bonder — semiconductor.directorysemiconductor.directory