8000

Packaging and bonding machines are used to attach semiconductor dies or other small components to a supporting package, substrate, or lead structure. In this class, the machine performs controlled joining operations that establish both physical attachment and electrical connection where required.

Such systems are part of back-end assembly equipment rather than wafer fabrication tools. They are designed to handle small parts precisely, apply heat or force in a controlled way, and support repeatable bonding results for production or development use.

The machine typically uses alignment features, motion stages, and process control to place the bond at the intended location and to repeat the same join cycle from part to part. The bonding action is followed by release and, where needed, movement to the next site for additional interconnections.

This class of equipment is used after die placement or other assembly steps and before final test, encapsulation, or downstream packaging operations. It supports the transition from individual components to a completed electronic assembly.

Packaging and bonding machines are generally used for semiconductor assembly, microelectronic interconnect formation, and related precision attachment tasks. They are also used wherever small electronic or optoelectronic parts must be fixed and electrically connected to a package, carrier, or substrate.