Waferpedia

Palomar

9000

Packaging & BondingPalomar 9000 family
Research Quality: 40% complete
9000 — web.archive.org
Fig. 019000web.archive.org[1]
  • Plate 019000 Wedge Bonder overview

    Palomar TechnologiesWatch on YouTube
  • Plate 02Palomar 9000 High-Speed Fine Wire Wedge and Ribbon Bonder

    Palomar TechnologiesWatch on YouTube

What is it?

The Palomar 9000 Wedge Bonder is described as a high-speed fine wire wedge and ribbon bonder with voice coil technology in the bond head. It has interchangeable 45-60° and 90° deep access wedge clamps and a single large 304 x 152 mm work area.

What can it run?

Process applications and technology nodes documented for this tool.

  • Disk drives
  • Large complex hybrids
  • RF and microwave devices
  • Compact hybrids
  • Fine pitch devices
  • Low profile wire bonds
  • Ribbon bonding
  • MCM power connections
  • Running stitch interconnects (die-to-die)
  • High frequency passive and active components

What do the numbers mean?

Configuration & options5

Machine type
High-speed fine wire wedge and ribbon bonder[1]
Accurate?
Bond head drive technology
Voice coil technology[1]
Accurate?
Wedge clamps
Interchangeable 45-60° and 90° deep access wedge clamps[1]
Accurate?
Work area
304 x 152 mm[1]
Accurate?
Bond head motion note
The entire bond head mechanism rides on theta[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 9000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 9000 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 9000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 9000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 9000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.orgweb.archive.org
  3. [3]9000 Wedge Bonderweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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