SE 75 D Injection

Machines of this class belong to semiconductor and electronics packaging equipment used to apply a liquid or molten encapsulant into a mold or cavity around a mounted device. The machine identity is centered on controlled material delivery, cavity filling, and cure-oriented packaging rather than on wafer-level processing.

Such systems are used to form a protective body around sensitive parts, interconnects, or subassemblies. The process supports electrical insulation, mechanical support, and environmental protection in packaged electronic devices.

A machine of this class prepares a thermosetting or similar encapsulant, conditions it for flow, and then drives it into a tool cavity under controlled pressure and temperature conditions. The material fills the mold around the target assembly and takes the shape of the cavity before solidifying.

The operating sequence generally includes material feed, metering, injection, cavity fill, hold, and release. Tooling and process control are used to limit voids, ensure full coverage, and produce repeatable package shape and encapsulation quality.

This class of machine sits in the back-end packaging flow after device assembly and before final inspection or downstream finishing steps. It is part of the stage where the assembled electronic element is converted into a protected package suitable for handling and use.

Machines of this class are generally used for semiconductor packages, power devices, and other electronic assemblies that require molded encapsulation or protective resin packaging. They are also used in applications where the package must provide environmental sealing, electrical isolation, and mechanical reinforcement.