Temescal
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The Temescal FCE-2700 is a deposition system. The Temescal FCE-2700 is an e-beam evaporation system used for Ti/Pt/Au metalization. The Temescal FCE-2700 has demonstrated metalization thicknesses in excess of 4μm.[1][2]
The FCE-2700 has been used to deposit Ti/Pt/Au metalization for semiconductor device fabrication.[2]
In the evaporated airbridge process, the system deposits a metal stack onto a substrate with a re-entrant resist profile, after which the resist and unwanted metal are removed.[2]
The system has been used to create evaporated airbridge structures for power pHEMT technology, achieving metalization thicknesses greater than four micrometers.[2]
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The Temescal FCE 2700 is an e-beam evaporation system.[2]
The following facts about the FCE-2700 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FCE-2700 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FCE-2700 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FCE-2700 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FCE-2700 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FCE-2700 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 20, 2026.