Deposition

The Denton Vacuum EE-4 is an electron beam deposition tool with a 6-position hearth, a dual chamber design, automated pump-down/venting, and capacity for multiple wafer sizes.

The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.

The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.

The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.

The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.

The CHA 50 S is an e-beam evaporator deposition system that includes a 5-pocket configuration, a Temescal CV 8 scan/beam controller, a Maxtech MDC 360 deposition monitor, and CTI 8-inch cryopumps with helium recharge units.

The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.

The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.

The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

The Varian CC2 is a vacuum gauge controller that is part of the Denton Discovery 18 sputter deposition system.

The Tokyo Electron Trias Metal is a semiconductor processing system that supports metal chemical vapor deposition (CVD) for Ti/TiN and metal etching, and handles 300 mm (12-inch) wafers.

The TEL Trias is a plasma nitridation deposition system handling 8-inch and 12-inch wafers.

The Oxford 100 Nitride is a deposition system manufactured by Oxford Instruments for depositing nitride layers.

The Plasmatherm Core Interface is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

The Tokyo Electron Alpha 6 S is a batch processing deposition system introduced in 2000, with a variant configured for low-pressure silicon nitride CVD on 8-inch wafers.

The Leybold MAG W 2800 CT is a turbo pump designed for vacuum systems, operating at 480 Hz.

The Aixtron AIX 2800 G 4 WW is a metal organic chemical vapor deposition (MOCVD) reactor designed for processing 8-inch wafers.

Temescal 4-pocket e-beam evaporation systems are used for vacuum deposition, including thin dielectric films and metal deposition.

The Angstrom Engineering EvoVac is a load-locked PVD tool for electron-beam evaporation, with additional resistive thermal evaporation, ion-assisted deposition, and sputter deposition capabilities.

The SPTS / STS Sigma FxP is a PVD system with 6-inch wafer size and 8-inch compatibility.

The ASM E 2000 is a radiantly heated, single-wafer epitaxial reactor for chemical vapor deposition of doped or undoped silicon layers on wafers up to 200 mm (8 inches).

The Telindy Plus I M 1 is an ALD furnace with a 125 wafer load size, dual boat system option, and 400 VAC 50/60 Hz 3-phase power.

The CHA SSC-1000 is a multi-station sputtering system configured with up to four RF or DC cathodes.

CHA SEC-1000 is a sputtering system described as a 10-inch system.

The CHA SSC-600 is a sputtering system described as a 6-inch system that supports sputter up or sputter down operation.

The AJA ATC Orion 8 UHV Sputtering System is a physical vapor deposition tool that deposits films on a substrate using magnetron sputtering.

Lam / Novellus Concept Two Triple Speed is a PECVD system for 8-inch wafers.

The Denton SJ20C is an e-beam evaporation tool used as a film thickness monitor and deposition controller.

CHA SE-1000 is a sputtering system described as a 10-inch system.

The Temescal CV-6S is an electron-beam evaporation system configured with a load-lock, dual 4-pocket e-beam sources, and a CV-6S 10 kV power supply.

The Temescal FC-2000 is a load-locked bell jar deposition system for small-scale production and R&D, with listed substrate fixtures for 2-inch, 3-inch, 100-mm, and 150-mm wafers.

The Lam / Novellus Concept Two Sequel is a PECVD (plasma-enhanced chemical vapor deposition) system for 8-inch wafers.

The Ulvac SME 200 J is a sputtering system.