Category
Deposition
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451 entries
- SJ20C/MaterialDenton Vacuum
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
CategoryDeposition - Centura Ultima+ HDPApplied Materials
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
CategoryDeposition - Explorer 14 RF SputtererDenton Vacuum
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
CategoryDeposition - Gasonics Triple Speed NFLam Research
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
CategoryDeposition - Producer IIIApplied Materials
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
CategoryDeposition - SRH 420 MC BacksideUlvacCategoryDeposition
- MultiplexSPTS
The SPTS Multiplex is a plasma-enhanced chemical vapor deposition (PECVD) system manufactured by SPTS/STS.
CategoryDeposition - CME 200 JUlvac
The Ulvac CME 200 J is a plasma-enhanced chemical vapor deposition (PECVD) system.
CategoryDeposition - 800 PlusOxford Instruments
Oxford Instruments 800 Plus is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.
CategoryDeposition - Gasonics Vector ExpressLam Research
The Lam / Novellus / Gasonics Vector Express is a PECVD system stated to be configured for 12-inch wafers.
CategoryDeposition - VersalinePlasma-Therm
The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.
CategoryDepositionWafer4" - FC-3800Temescal
The Temescal FC-3800 is a production evaporation system used for depositing coatings onto compound semiconductor substrates.
CategoryDeposition - Endura 2Applied Materials
Applied Materials Endura 2 is a 12-inch PVD (physical vapor deposition) system used for liner/barrier and front-end metallization applications.
CategoryDeposition - BCD-2800Temescal
The Temescal BCD-2800 is a deposition system in the Temescal family of production evaporation systems.
CategoryDeposition - TES 44Temescal
The TES 44 is a fast cycle load locked, sputter down system with a water cooled, RF bias, rotating substrate table.
CategoryDeposition - TES 600Temescal
The TES 600 is a horizontal-process sputtering system featuring a dual-level load lock, pallet handling of 12" x 12" substrates, up to three 5" x 15" magnetron cathodes, and deposition uniformity of +/-5%.
CategoryDeposition - DV 502 A VacuumDenton Vacuum
The Denton DV 502 A is a vacuum evaporator with a 12-inch diameter by 12-inch-high bell jar and an implosion guard.
CategoryDeposition - TES 900Temescal
The Temescal TES 900 is a vertical-process sputtering system with a dual-level load lock and a 12" x 12" pallet substrate carrier.
CategoryDeposition - 0010-13622 RF Match forApplied Materials
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
CategoryDeposition - Trias MetalTokyo Electron
The Tokyo Electron Trias Metal is a semiconductor processing system that supports metal chemical vapor deposition (CVD) for Ti/TiN and metal etching, and handles 300 mm (12-inch) wafers.
CategoryDeposition - 100 CB SpinCEE
The CEE 100 CB Spin is a spin coater from the CEE 100 family.
CategoryDeposition - Trias Plasma NitridationTokyo Electron
The TEL Trias is a plasma nitridation deposition system handling 8-inch and 12-inch wafers.
CategoryDeposition - AIX G 5 WW EPI ReactorAixtron
The Aixtron AIX G 5 WW EPI Reactor is an epitaxial silicon deposition system for 4-inch wafers.
CategoryDeposition - VEXPLam Research
The Lam VEXP is a chemical vapor deposition (CVD) system manufactured by Lam Research.
CategoryDeposition - VectorLam Research
Lam Research Vector is a PECVD deposition platform for dielectric film deposition.
CategoryDeposition - Alpha 6 STokyo Electron
The Tokyo Electron Alpha 6 S is a batch processing deposition system introduced in 2000, with a variant configured for low-pressure silicon nitride CVD on 8-inch wafers.
CategoryDeposition - Centura Ultima TE HDPApplied Materials
The Applied Materials Centura Ultima TE HDP is a high-density plasma chemical vapor deposition (HDP CVD) system for 8-inch wafers, configured with one Ultima TE chamber, two DxZ nitride chambers, one wafer orienter chamber, and one multi-slot cooldown chamber.
CategoryDepositionWafer(1) Wafer Orienter Chamber - Charger UMBApplied Materials
Applied Materials Charger UMB is a PVD (physical vapor deposition) mainframe with 3 chambers and compatibility with Endura.
CategoryDeposition - AIX 2400 Planetary ReactorAixtronCategoryDeposition
- AIX 2800 G 4 WW MOCVD ReactorAixtron
The Aixtron AIX 2800 G 4 WW is a metal organic chemical vapor deposition (MOCVD) reactor designed for processing 8-inch wafers.
CategoryDeposition - AIX R 6 MOCVDAixtron
The Aixtron AIX R 6 is a metal organic chemical vapor deposition system.
CategoryDeposition - SSC-1000CHA
The CHA SSC-1000 is a multi-station sputtering system configured with up to four RF or DC cathodes.
CategoryDepositionWafer10 in. - 4410Perkin Elmer
The Perkin Elmer 4410 is a sputtering system.
CategoryDeposition - Producer GT APFApplied Materials
Applied Materials Producer GT APF is a PECVD (plasma-enhanced chemical vapor deposition) system.
CategoryDeposition - Centura DPHeApplied MaterialsCategoryDeposition
- Producer XP APF KodiakApplied Materials
The Applied Materials Producer XP APF Kodiak is a plasma-enhanced chemical vapor deposition (PECVD) system for 300mm wafers with three Kodiac chambers.
CategoryDeposition - 2600 G 3 HT IC MOCVD ReactorAixtron
The Aixtron 2600 G 3 HT IC MOCVD Reactor is a deposition tool for InGaN MOCVD epitaxy with support for 6 x 6-inch wafers.
CategoryDeposition - Endura 300 Aluminum InterconnectApplied Materials
The Applied Materials Endura 300 Aluminum Interconnect is a physical vapor deposition (PVD) system designed for 300 mm (12 inch) wafers.
CategoryDeposition - Endura CL VersaApplied Materials
The Applied Materials Endura CL Versa is a physical vapor deposition system from the Endura family, configured with TTN 3CH + Degas STD 2CH.
CategoryDeposition - Endura 300Applied Materials
The Applied Materials Endura 300 is a PVD (Physical Vapor Deposition) system configured for 300mm wafers.
CategoryDeposition - Titan LoadlockTrion
The Trion Titan Loadlock is a plasma deposition system configured for 3-inch wafers.
CategoryDeposition - Centura HPApplied Materials
Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
CategoryDeposition - ImpulseApplied Materials
The Applied Materials Impulse is a PVD system used for sputtering on 12 inch wafers.
CategoryDeposition - 2600 G 3 IC R MOCVD ReactorAixtron
The Aixtron 2600 G 3 IC R is a MOCVD reactor configured for AlInGaP MOCVD epitaxy and 7 x 6-inch wafers.
CategoryDeposition - Tytan 1600 LPCVDTystar
The Tystar Tytan 1600 LPCVD is a low pressure chemical vapor deposition system.
CategoryDeposition - NexDepAngstrom Engineering
The Angstrom NexDep Thermal E-Beam Evaporator is a physical vapor deposition tool that offers e-beam and thermal evaporation, with NexDep 2 also offering ion assisted deposition.
CategoryDeposition - 635CHA
CHA Industries’ 635 Series modular deposition systems support both sputtering and evaporation for semiconductor and compound semiconductor wafer coating.
CategoryDeposition - MultiplexSTS
The STS Multiplex is a PECVD deposition system for 6-inch wafers, processing silicon nitride with gases including oxygen, carbon tetrafluoride, silane, nitrous oxide, and ammonia.
CategoryDeposition - 660MKS
The MKS 660 is a sputter deposition system for metals, alloys, and insulating thin films with a 6-inch diameter stage.
CategoryDepositionWafer6-inch diameter stage - Solution E-BeamCHA
The CHA Solution E-Beam Evaporator is an E-beam evaporator with a listed Glassman power supply.
CategoryDeposition - EvoVacAngstrom Engineering
The Angstrom Engineering EvoVac is a load-locked PVD tool for electron-beam evaporation, with additional resistive thermal evaporation, ion-assisted deposition, and sputter deposition capabilities.
CategoryDepositionWafer6 in - Criterion Solution SEC-600/SE-600CHA
The CHA Criterion Solution SEC-600/SE-600 is a vacuum deposition system for precision coating.
CategoryDeposition - Centura Giga-FillApplied Materials
The Applied Materials Centura Giga-Fill is a chemical vapor deposition (CVD) cluster tool designed for sub-atmospheric CVD (SACVD) of borophosphosilicate glass (BPSG) on 200 mm wafers.
CategoryDeposition - Mark-40CHA
The CHA Mark-40 is a vacuum evaporation system described as combining features of the Mark 50 system with a broad array of options.
CategoryDeposition - Ei 7 K VacuumUlvacCategoryDeposition
- EBX 2000 High Vacuum EvaporationUlvac
The Ulvac EBX 2000 is a high vacuum evaporation system manufactured by Ulvac, with a reported vintage of 2005.
CategoryDeposition - Concept OneLam Research
The Lam / Novellus Concept One is a chemical vapor deposition (CVD) system used for depositing thin films on semiconductor wafers.
CategoryDeposition - CC2Varian
The Varian CC2 is a vacuum gauge controller that is part of the Denton Discovery 18 sputter deposition system.
CategoryDepositionWafer6" - Kokusai DJ 1223 VHitachiCategoryDeposition
- Concept Two Dual SequelLam Research
The Lam Research (Novellus) Concept Two Dual Sequel is a chemical vapor deposition (CVD) system.
CategoryDeposition
