Temescal

The TES 600 is a sputtering deposition system in the Temescal TES family.[1]
The TES 600 uses a fast cycle dual level load lock for exchanging a completed pallet load of substrates with a new pallet load.[1]
The TES 600 moves the substrate pallet in a linear motion in front of up to three magnetron cathodes.[1]
The TES 600 places RF etch and substrate heating in the process chamber.[1]
The TES 600 supports continuous operation through exchange of a completed pallet load with a new pallet load.[1]
The TES 600 is used for sputtering deposition in thin film process work.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| TES 900 | — | — | Vertical process chamber (as opposed to horizontal for TES 600) | tescal.com[1] |
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The TES 600 exchanges a completed 12 by 12 pallet load of substrates with a new pallet load.[1]
The TES 600 can move the pallet in front of up to three 5 by 15 magnetron cathodes.[1]
The TES 600 includes RF etch and substrate heating in the process chamber.[1]
The following facts about the TES 600 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TES 600 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the TES 600 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TES 600 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TES 600 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the TES 600 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 3, 2026.
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