Wyko

SP3200

Research Quality: 40% complete

What is it?

The Wyko SP3200 Surface Profiler is described as an advanced packaging profiling system designed for in-line process monitoring of flip-chip packaging. It provides dual process control capabilities as both a surface metrology tool and a defect inspection tool, and it supports measurement and inspection functions for advanced packaging substrates.

What can it run?

Process applications and technology nodes documented for this tool.

In-line process monitoring of flip-chip packaging
Advanced packaging substrates

What do the numbers mean?

Control & software2

Application software: Wyko Vision32 analysis software^[2]
Software features: Specialized algorithms, automation scripting language, integrated database, automatic data logging, and real-time go/no-go feedback^[2]

Dimensions & facilities1

Surface metrology measurements: Calculates bump height, diameter, volume, and three-point and regression coplanarity^[1]

Configuration & options4

System type: Gauge-capable surface profiler^[1]
Functional roles: Surface metrology tool and defect inspection tool^[1]
Defect inspection capabilities: Automatically detects solder bridges, under & oversized bumps, missing & extra solder bumps, and bump position^[1]
Database function: Master database allows trending analysis over a product's lifecycle^[2]

Interested in this tool?

Embed spec card

What replaced it?

siblingWyko SP3000— Listed alongside the SP3200 in the product lineup.source^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What is the Wyko SP3200 used for?

It is designed for in-line process monitoring of flip-chip packaging, combining surface metrology and defect inspection functions for advanced packaging substrates.^[1]

What defects can the Wyko SP3200 detect?

It automatically detects solder bridges, under and oversized bumps, missing and extra solder bumps, and bump position.^[1]

What measurements does the Wyko SP3200 calculate?

It calculates bump height, diameter, volume, and three-point and regression coplanarity.^[1]

Not publicly documented

The following facts about the SP3200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SP3200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SP3200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SP3200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SP3200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SP3200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report