ASM
AB 559 A 06 Wedge alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
West Bond
7476 E 79 Wedge
Packaging & Bonding
The WestBond 7476 E 79 Wedge is a wedge wire bonder with deep access and several specified operating features.
Kulicke & Soffa
Asterion SV Hybrid Wedge
Packaging & Bonding
The K&S Asterion SV Hybrid Wedge Bonder is a bond equipment model with a 300 mm x 95 mm bondable area and several listed electrical and pneumatic specifications.
Hesse & Knipps
BJ 820 V 1 Wedge
Packaging & Bonding
Hesse & Knipps (H&K) BJ 820 V 1 Wedge Bonder.
Kulicke & Soffa
IBond 5000
Packaging & Bonding
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
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