Waferpedia

Comparison ledger

200 PCUversusGSD 100

Axcelis 200 PCU, Axcelis GSD 100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
GSD 100Axcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size—No wafer top-side bar reading
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Axcelis GSD
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]—
High Current—GSD 200 E[4]
Date of Audit—August 25, 2025[4]
Loading Configuration—Open Cassette[4]
Software Version—6.12.4[4]
Configuration—Automated Beam tuning & setup w/Eaton Autotune[4]
Beamline version—Standard[4]
Energy Range—160 KeV[4]
Single Stage Extraction—80 keV[4]
Post Accel electrode assembly—80 -160 keV[4]
Ion Source Type—ELS[4]
Source Material—Moly[4]
Cryo compressors—CTI 9600[4]
Manufacturer—Axcelis[4]
Model—GSD 100[4]
Equipment Type—Implanter[5]
Wafer Size—6 inch[4]
GEM / SECS Interface—Present[4]
Automated Beam Tuning—Automated Beam tuning & setup w/Eaton Autotune[4]
Compatibility—4 cassette compatibility[4]
Automatic Alignment—Automatic flat or notch alignment capability with buffer cassette[4]
Process Disk—NV-GSD 200 Series Process Disk with active cooling & chiller[4]
Beamline Pump—CTI Onboard 10[4]
End Station Cryo Pump—CTI Onboard 8[4]
Source Turbo Pump—STP A 2203 C 2[4]
Gas Connections—Ar, N2[4]
Remote Disk Chiller—SMC HRS 050-WF-20[4]
External Facilities connections—Ar, N2[4]
Wafer size—No wafer top-side bar reading[4]
Source Turbo Pump (P1)—STP A 2203 C 2[4]
Beam Line Cryo Pump (P3)—CTI Onboard 10[4]
End Station Cryo Pump (P2)—CTI Onboard 8[4]
Ar—Tylan FC-2900 MEP, 5 SCCM[4]
Ar MFC—Tylan FC-2900 MEP, 5 SCCM[4]
BF3 Gas—Unit 1660 (SDS), 5 SCCM[4]
AsH3 Gas—Unit 1660 (SDS), 5 SCCM[4]
PH3 Gas—Unit 1660 (SDS), 5 SCCM[4]
Electrical Input—3-phase, 208 V[5]
Power Consumption—50 kVA[5]
Beam Current—15 mA[5]
Output Rating—160 kV[5]
Flag Faraday Injector—Present[4]
Signal Tower—Present[4]
Direct Drive—Yes[4]
Electron Shower—Yes[6]
Cell V6 Control—Yes[6]
Solaris—Yes[6]
SDS Gas Box—Yes[6]
Cassette Compatibility—4 cassette compatibility[4]
Automatic Flat/Notch Alignment—Yes, with buffer cassette[4]
Standard Manuals Included—Yes[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]waferpedia.comwaferpedia.com