Disco
DAD 340 Wafer alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Strasbaugh
7 AF Back
Dicing & Grinding
The Strasbaugh 7 AF Back Grinder is a wafer back-grinding tool that can process 8-inch silicon wafers.
ADT
8020 Auto Twin Dicing
Dicing & Grinding
The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system for 8-inch workpieces.
Accretech
AD 3000 T Dicing
Dicing & Grinding
The Accretech AD 3000 T Dicing is a fully automatic dicing saw for 300 mm wafers.
Accretech
SS 20 Automatic Dicing
Dicing & Grinding
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a surface grinder used in Dicing & Grinding applications.
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare DAD 340 Wafer with another model →