Accretech
AD 3000 T Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Accretech AD 3000 T Dicing is a fully automatic dicing machine for Φ305 mm wafers. The Accretech AD 3000 T Dicing uses opposing two-axis spindles arranged diagonally. The Accretech AD 3000 T Dicing has a spindle rated at 1.8 kW with a maximum rotation speed of 60,000 rpm.[1][2]
What it is
How it works
Where it fits in the process flow
Applications
General reference — not yet source-verifiedDicing machines are used for singulating semiconductor wafers into individual devices and for other wafer-cutting tasks that require precise separation.
What do the numbers mean?
Power & electrical4
Vacuum & pumping1
Wafer handling1
Control & software1
Dimensions & facilities2
Configuration & options21
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Disco DFD 6340 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
- Disco DAD 3350 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[7]
- Disco DAD 340 Wafer— Same function class: Dicing & Grinding, nullCompare in depthsource[8]
- Disco DFD 6341 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[9]
- Disco DFD 6341— Same function class: Dicing & Grinding, nullCompare in depthsource[10]
- Disco 641 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[11]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the AD 3000 T Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 3000 T Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AD 3000 T Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AD 3000 T Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AD 3000 T Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AD 3000 T Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (12)Every fact above is drawn from these public sources
- [1]accretech.com — accretech.comaccretech.com
- [2]https://www.accretech.com/en/assets/ad3000t-plus_e.pdf — accretech.comaccretech.com
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Equipment inventory listing
- [7]web.archive.orgweb.archive.org
- [8]waferpedia.comwaferpedia.com
- [9]Equipment inventory listing
- [10]web.archive.orgweb.archive.org
- [11]nanofab.utah.edunanofab.utah.edu
- [12]Fully Automatic Dicing Machine – AD3000T-PLUS | Accretech — accretech.euaccretech.eu
Last updated Oct 17, 2026.
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The Disco 641 Dicing Saw is a dicing machine from Disco. The Disco 641 Dicing Saw has a maximum power specification of AC 200 V, 50/60 Hz, 3 phase, 4 kVA.
The Disco DAD 3350 is an automatic dicing saw.
The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.
The Disco DFD 6340 is an automatic dicing saw.
The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.
General referenceThe Disco DFD 6341 Automatic Dicing is an automatic dicing saw, a machine used in semiconductor and precision optics manufacturing to singulate individual devices from a substrate.