Disco
DFL7340-stealth-dicer alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
EV Group
850 LT SOI Fusion Wafer
200mm
Packaging & Bonding
The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.
Disco
dad3240-dicing-saw
200mm
Packaging & Bonding
The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.
Disco
DFL7340
200mm
Packaging & Bonding
The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.
EV Group
Gemini Automated Production Wafer
200mm
Packaging & Bonding
The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
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