Kulicke & Soffa
Rapid Plus alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Hybond
572 A 40 Thermosonic Wire & Ribbon
Packaging & Bonding
The Hybond 572 A 40 is a thermosonic wire and ribbon bonder with long-reach bonding, wire and ribbon capability, and a 6 x 8.5 inch work platform.
West Bond
7476 E 79 Wedge
Packaging & Bonding
The WestBond 7476 E 79 Wedge is a wedge wire bonder with deep access and several specified operating features.
F&K Delvotec
G 5 62000
Packaging & Bonding
The F&K Delvotec G 5 62000 is a wire bonder described as running with 25 µm wire and a ball/wedge bondhead.
Shinkawa
UTC 1000
Packaging & Bonding
The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
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