Shinkawa

Plate 01SHINKAWA UTC 1000 SUPER WIRE BONDER
Plate 02USED BCP-05B board for shinkawa UTC-1000
Plate 03USED BCP-05C board for shinkawa UTC-1000
Plate 04USED ZUP-02D board for shinkawa UTC-1000
Plate 05USED FRP-341E board for shinkawa UTC-1000
Plate 06A048602-2, UTC-1000 Bond Head
The source lists vintage years 2005 (21), 2006 (7), and 2007 (4).
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the UTC 1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the UTC 1000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the UTC 1000 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Jul 29, 2026.
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