Meyer Burger
OC 266 Wafer alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
ADT
8020 Auto Twin Dicing
Dicing & Grinding
The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system for 8-inch workpieces.
Disco
DAD 3221 Automatic Dicing
Dicing & Grinding
The Disco DAD 3221 Automatic Dicing Saw is a single-spindle dicing saw for wafers up to 6 inches, with a 6-inch porous chuck table and an automatic pattern-recognition and alignment system.
Disco
DFD 6340 Automatic Dicing
Dicing & Grinding
The Disco DFD 6340 is an automatic dicing saw.
Disco
DFD 6340 Fully Automatic Dicing
Dicing & Grinding
The Disco DFD 6340 is a fully automatic dicing saw designed for 8-inch wafers.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a surface grinder used in Dicing & Grinding applications.
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