Pfeiffer
Alcatel Adixen AMS 200 DRIE alternatives
Comparable Etch equipment documented in the Waferpedia catalog.
6 comparable tools
Applied Materials
0010 47763
Etch
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
Applied Materials
0010-16392 ESC Assembly
Etch
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Applied Materials
0041-39086 ESC Part
Etch
Oxford Instruments
100 ICP Fluorine
Etch
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
Tegal
1511e
three- to six-inch wafers
Etch
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.
Tegal
1512e
Etch
The Tegal 1512e is an industrial RIE plasma etcher system with modules assembly for CI-4222.
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare Alcatel Adixen AMS 200 DRIE with another model →