Waferpedia

Comparison ledger

DSS 200 Series II Waferversus1000FP

Ontrak DSS 200 Series II Wafer, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMOntrakYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2023 Introduced—
Control system——
Generation——
FamilyOntrak DSS 200YES 1000FP
Specifications
ConfigurationPost CMP[1]—
MakeOntrak[1]—
ModelDSS 200 Series II Wafer[1]Glen/YES 1000FP[3]
Equipment typeWafer Scrubber[1]—
Wafer sizes6 inch[1]—
Tool descriptionpost-CMP semiconductor process tool[2]—
Applicationcleaning wafers after chemical mechanical polishing[2]—
Wafer size8 inch[2]—
Tool typeWafer Scrubber[1]—
Process usePost CMP[1]—
Introduced2023[2]—
Power200 / 208 / 220 VAC[2]—
Frequency50/60 Hz[2]—
Breaker25 A (5.2 kW)[2]—
Total FLA6.8 A (1.4 kW)[2]—
CDA inlet pressure80-100 PSI[2]—
DI water inlet pressure60-80 PSI[2]—
Process solutions / chems inlet pressure15 PSI[2]—
Noise level during process70 dB[2]—
System type—Plasma cleaning system[3]
Line—R-Series Plasma Cleaning Systems (Glen Technologies)[3]
Designed use—Designed to accept a range of shelf sizes[3]
Application focus—Changing needs of the flat panel industry[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]web.archive.orgweb.archive.org