Waferpedia

Ontrak

DSS 200 Series II Post

CMPIntroduced Ontrak DSS 200 family
Research Quality: 60% complete
DSS 200 Series II Post — Inventory photo
Fig. 01DSS 200 Series II PostInventory photo[1]

Introduced

2023

Power

200/ 208 / 220 VAC[1]

Vacuum

80-100 PSI (Inlet)[1]

What it is

The Ontrak DSS 200 Series II Post CMP Scrubber is a semiconductor process tool used after chemical mechanical polishing. It is an 8-inch wafer system in the DSS 200 Series II model line.[1][2][5][6][3]

How it works

General reference — not yet source-verified

As a post-CMP scrubber, the machine typically applies wet cleaning, mechanical handling, and rinse and dry sequencing to remove polishing residues from the wafer surface. This class of tool is built around controlled fluid delivery, particulate removal, and wafer transport between cleaning stages.

Where it fits in the process flow

General reference — not yet source-verified

In a wafer flow, this type of equipment follows CMP and precedes later inspection, deposition, lithography, or other downstream processing steps that depend on a clean surface. Its function is tied to surface conditioning rather than patterning or material removal.

Applications

General reference — not yet source-verified

Tools of this class are used for cleaning planarized wafer surfaces across mature-node process flows and other applications that rely on consistent wafer surface preparation after polishing.

  • Post CMP scrubber
  • Chemical mechanical polishing

What do the numbers mean?

Power & electrical8

Voltage
200/ 208 / 220 VAC[1]
Accurate?
50/60 Hz[1]
Accurate?
Breaker
25 A (5.2 kW)[1]
Accurate?
Total FLA
6.8 A (1.4 kW)[1]
Accurate?
Voltage
200 / 208 / 220 VAC[3]
Accurate?
Total FL
6.8 A (1.4 kW)[3]
Accurate?
Largest Load
3.6 A (0.8 kW)[3]
Accurate?
Voltage
200/208/220 VAC (50/60Hz)[4]
Accurate?

Vacuum & pumping3

CDA (Clean Dry Air)
80-100 PSI (Inlet)[1]
Accurate?
DI Water
60-80 PSI (Inlet)[1]
Accurate?
Process Solutions / Chems
15 PSI (Inlet)[1]
Accurate?

Dimensions & facilities1

CDA (Clean Dry Air)
80-100PSI (Inlet), 3/8” OD tubing[4]
Accurate?

Configuration & options12

Largest Load
3.6 A (0.8kW)[1]
Accurate?
3/8" OD Tubing[1]
Accurate?
3/4" OD Teflon Tubing[1]
Accurate?
1/4" OD Teflon Tubing[1]
Accurate?
Drain
132 GpH Peak, 60 GpH Idle, 2" CPVC[1]
Accurate?
Noise Level
70 dB (during process)[1]
Accurate?
Breaker
25A (5,2kW)[4]
Accurate?
Total FLA
6,8A (1,4kW)[4]
Accurate?
Largest load
3,6A (0,8kW)[4]
Accurate?
DI Water
60-80PSI (Inlet), 3/4" OD Teflon tubing[4]
Accurate?
Process solutions/chems
15PSI (Inlet), 1/4" OD Teflon tubing[4]
Accurate?
Drain
132GpH peak, 60GpH idle. 2” CPVC[4]
Accurate?
Interested in this tool?
Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage200/ 208 / 220 VAC[1]
  • Configuration50/60 Hz[1]
  • Breaker25 A (5.2 kW)[1]
  • Total FLA6.8 A (1.4 kW)[1]
  • CDA (Clean Dry Air)80-100 PSI (Inlet)[1]
  • DI Water60-80 PSI (Inlet)[1]
  • Process Solutions / Chems15 PSI (Inlet)[1]
  • Voltage200 / 208 / 220 VAC[3]
  • Total FL6.8 A (1.4 kW)[3]
  • Largest Load3.6 A (0.8 kW)[3]
  • Voltage200/208/220 VAC (50/60Hz)[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What kind of equipment class is this?General reference — not yet source-verified

It is a CMP-related machine class used in planarization-support or post-process handling workflows.

Does this class perform the polishing itself?General reference — not yet source-verified

Not necessarily. Machines of this class may support the polishing sequence by handling, transferring, or conditioning workpieces around the CMP step.

Where is this class used in production?General reference — not yet source-verified

It is used in process areas that manage substrate movement and surface preparation around CMP operations.

What is this class generally used for?General reference — not yet source-verified

It is generally used to maintain controlled flow, surface condition, and process consistency in CMP-related manufacturing.

Not publicly documented

The following facts about the DSS 200 Series II Post are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DSS 200 Series II Post are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DSS 200 Series II Post are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DSS 200 Series II Post are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DSS 200 Series II Post are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DSS 200 Series II Post is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing
Was this page accurate?

Last updated Jul 30, 2026.

Compare with similar tools

View all →