Tool family
ASM AB 559
Models in this family
The ASM AB 559 A 06 Wedge is a packaging and bonding machine class used to make wire bonds between semiconductor devices and their packages or interconnect structures. It belongs to the class of wedge bonding systems used in assembly operations.
ASM AB 559 A IL 08 is a wedge wire bonder.
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- AB 559 A 06ASMCategoryPackaging & Bonding4 specs
- AB 559 A 06 WedgeASM
General referenceThe ASM AB 559 A 06 Wedge is a packaging and bonding machine class used to make wire bonds between semiconductor devices and their packages or interconnect structures. It belongs to the class of wedge bonding systems used in assembly operations.
CategoryPackaging & Bonding3 specs - AB 559 A IL 08 WedgeASM
ASM AB 559 A IL 08 is a wedge wire bonder.
CategoryPackaging & Bonding2 specs