ASM

The ASM AS 899 is a test and sort machine.

The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

The ASM AD 896 M is a die bonder.

ASM ADL 838 L G 2 Dual Epoxy System is a dual epoxy system with an uplook camera, wafer table with wafer expander for 8-inch wafers, automatic wafer loader for 8-inch wafers, needle ejector, and input/output magazine handlers.

The ASM E 2000 is a radiantly heated, single-wafer epitaxial reactor for chemical vapor deposition of doped or undoped silicon layers on wafers up to 200 mm (8 inches).

The ASM Peva 900 E is a planetary wafer system with a 4-crucible turret.

The ASM AD 898 is an automatic die bonder manufactured by ASM.

The ASM AD 896 is an automatic die bonder introduced in 2004.

ASM AD 838 L G 2 is a die bonder with support for 6-inch and 8-inch wafer sizes.

ASM Siplace CA 4 Wafer is an 8-inch wafer system described as a high-volume chip assembly and 4-portal microchip/SMD hybrid assembly system.

ASM Eagle is a PECVD (plasma-enhanced chemical vapor deposition) system described as a 2-chamber unit with SiH4, N2O, and C3F8 gases.

The ASM A 412 Dual Reactor is a semiconductor processing tool used for deposition of nitride or doped polysilicon.

The ASM MS 896 is a mapping die sorter.