Besi 2100 FC

Models in this family

1. 

   2100 FC

   The Besi Esec 2100 FC is a flip chip die bonder capable of 8 µm placement accuracy and up to 16,000 UPH.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Esec 2100 FC plus	—	—	Bonding accuracy down to 10 µm (3σ); min. cycle time 400 ms; die size 0.5 … 20 mm; die thickness ≥ 0.1 mm.	micro-power.com.hk[1]

Sources