Besi

The Besi 2200 EVO Tool Holder is a tool holder component for the Datacon 2200 EVO die bonder.

The Besi Datacon 2200 EVO is a high-accuracy multi-chip die bonder for die attach and flip chip applications.

The Besi / Datacon 2200 EVO is a die bonder hybrid.

The Besi DS 9000 is a die sorter manufactured by Besi (Datacon).

The Besi / Datacon 2200 APM is a die attach / flip chip machine.

The Besi / Datacon 2009 SSI E is a die bonder described as a soft solder wire dispense system with a single wafer loader and magazine-to-magazine handling.

The Besi / Datacon 2220 EVO is a multi-chip die bonder with an accuracy of ±10 µm at 3 sigma.

The Besi / Datacon 2200 EVO Multi-Chip is a dual-head die sorter.

The Besi 2200 EVO Plus Die Bonder Hybrid is a hybrid die bonder manufactured by Besi / Datacon.

The Besi / Datacon DS 9000 E is a bonder with an 8-inch wafer size and 208 VAC single-phase, 50/60 Hz power specifications.

The Besi / Esec 2100 FC hS is a die bonder with flip chip capability.

The Besi / Datacon DC 2200 EVO is a single-head die bonder.

The Besi / Datacon 2200 APM+ is a die attach machine.