Waferpedia

Tool family

Disco KR15

The Disco KR15 blade is listed as a 200 micron, low-grit blade for sapphire, glass, and silicon.

Models in this family

  1. The Disco KR15 is a 200-micron-thick, low-grit dicing blade used for cutting sapphire, glass, and silicon samples.

    Cited variants

    DesignationGenerationVintageChangesSource
    KR15-A/KR15-BAvailable as without cover or with cover, and as direct motor coupling or motor wrap versions.thk.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]thk.comthk.com