Disco

The Disco DAD641 is an automatic dicing saw used for wafer dicing operations.

The Disco DAD3241 is a high-productivity automatic dicing saw that supports large workpieces up to Φ8”.

The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The DISCO DCS1460 is an automatic cleaning system for Φ300 mm wafers used to clean workpieces that have been cut on a dicing saw.

The Disco DAD 522 is an automatic dicing saw.

The Disco DFD 6340 is a fully automatic dicing saw designed for 8-inch wafers.

The Disco DTU 152 Water Temperature Controller is designed to maintain constant temperature and pressure for spindle cooling water and cutting water in dicing saws, while reducing water consumption and environmental impact through water circulation and filtration.

The Disco DAD 2 H / 6 is an automatic dicing saw.

The Disco 841 (DFG 841) is a back grinder for semiconductor wafers, handling sizes from 4 to 8 inches with two-spindle, two-chuck table configuration.

The Disco DFD 8540 is a grinder manufactured by Disco.

The Disco LEN 40 SSU 002 A is a vacuum unit.

The Disco DAD 651 is an automatic dicing saw used in semiconductor manufacturing.

The Disco DAD3221 is an automatic dicing saw for 100 mm and 150 mm wafers.

The Disco DAD 3350 is a dicing saw used for dicing silicon wafers into individual masters for microfluidic devices.

General referenceDisco Dicing is a dicing and grinding machine used to separate processed substrates and shape their edges or thickness as part of precision singulation work. It belongs to a class of equipment used in back-end semiconductor and precision substrate processing.

The Disco DFD 641 is an automatic dicing saw.

The Disco DCS 1440 is an automatic cleaning system used to clean workpieces cut on a dicing saw, supporting workpiece sizes up to 250 mm square.

The Disco DFD6240 is a fully automatic single-spindle dicing saw for 200 mm wafers, designed for dicing silicon and compound semiconductors and for cutting and grooving ceramics, glasses, and other materials.

The Disco DAD 322 is an automatic dicing saw for cutting semiconductor wafers.

Disco DFD 651 is an automatic dicing saw used for semiconductor wafer dicing.

The Disco DAD 3350 is an automatic dicing saw.

The Disco DAD 3220 is an automatic dicing saw with source-stated configurations including a 1.5 kW spindle, a 1000 watt spindle, and a 40,000 min spindle revolutions specification.

The Disco DFL 7160 Automatic is an automatic laser saw for 12-inch wafers.

The Disco EAD 6450 is a saw used in semiconductor manufacturing.