Disco

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The Disco DAD 3350 is an automatic dicing saw.

The Disco DAG810 is a compact automatic surface grinder used for thinning silicon, III/V materials, glass types, wafers, stacked wafers, and chips.

The Disco DFG 8540 Back Grinder is a fully automatic grinder for wafer thinning. The Disco DFG 8540 Back Grinder supports 8 inch wafers with a universal chuck table and uses anomalous in-feed grinding with wafer rotation.

General referenceThe Disco EAD 695 + is a test and probe system. Machines of this class are used to make temporary electrical contact to semiconductor devices or related substrates so they can be measured, screened, and verified during manufacturing.

The Disco 841 (DFG 841) is a back grinder for semiconductor wafers, handling sizes from 4 to 8 inches with two-spindle, two-chuck table configuration.

The Disco DFL 7361 is a laser saw with a Type FX laser head, BSS-6 optics system, and integrated wafer cleaning system with atomizing nozzle.

The Disco DFD 6362 is an automatic dicing saw for semiconductor wafer singulation, supporting 8-inch wafers.

The Disco DFD 6362 Automatic Dicing is an automatic dicing saw.

The Disco DFD 8540 is a grinder manufactured by Disco.

The Disco DFL 7161 is a fully automatic laser saw for 300 mm wafers that performs ablation processing with integrated coating and cleaning.

The Disco DFL 7340 Fully Automatic is a fully automatic laser saw.

The Disco LEN 40 SSU 002 A is a vacuum unit.

The Disco DFD 650 is a fully automatic dicing saw with vintage years 1994, 1995, and 1997.

The Disco DFD 641 is a fully automatic dicing saw offered by Disco, with stated unit vintages of 1998, 1999, 2002, 2003, and 2005.

The Disco DFD 640 is a fully automatic dicing saw for cutting/slotting various wafers.

The Disco DFD 6341 is a fully automatic dual spindle dicing saw designed for Φ8-inch wafers, offering X-axis return speeds up to 1,000 mm/s.

The Disco DAD 552 is an automatic dicing saw.

The Disco DFD 6361 is an automatic dicing saw.

The Disco DFD 641 is an automatic dicing saw.

Disco dicing saw handles up to 8 inch substrates and is used for dicing silicon, bonded Si wafers, and glasses.

The Disco DFD 6361 is a fully automatic dicing saw designed for 300 mm wafers, featuring a facing dual-spindle design and Synchro Spindle for consistent cut quality.

The Disco DAD 3220 is an automatic dicing saw with source-stated configurations including a 1.5 kW spindle, a 1000 watt spindle, and a 40,000 min spindle revolutions specification.

The Disco DAD 3230 is an automatic dicing saw.

The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.

The Disco DAD3220 is an automatic dicing saw designed for compactness and compatibility with 6-inch wafers and 6x6-inch workpieces.

The Disco DAD321 is an automatic dicing saw for silicon, glass, and pyrex wafers, with support for 100 mm and 150 mm wafers.

The Disco DFG 850 is a back grinder for semiconductor wafer thinning.

The Disco DFD 6340 is a fully automatic dicing saw designed for 8-inch wafers.

The Disco DCS 1440 is an automatic cleaning system used to clean workpieces cut on a dicing saw, supporting workpiece sizes up to 250 mm square.

The Disco DAD 322 is an automatic dicing saw for cutting semiconductor wafers.

The Disco DFG 840 is an automatic in-feed surface grinder for semiconductor wafer thinning, handling wafers from 4 to 8 inches.

The Disco DAD 522 is an automatic dicing saw.

The Disco DTU 1531 is a chiller.

The Disco DAD 651 is an automatic dicing saw used in semiconductor manufacturing.

The Disco F DFP 8160 Fully Automated Polisher is a fully automated polisher for 8-inch to 12-inch wafers.

The Disco DAD 322 is a dicing saw used to dice a wafer mounted on UV tape with a diamond blade.

The Disco DUT 152 TCU is a temperature control unit manufactured by Disco.

The Disco DFU 2 CR E is a cutting water filtration unit manufactured in 2009.

The DFD6750 is a fully automatic dicing saw that uses dual chuck tables to increase productivity, supports two spindle types (1.8 kW and 2.2 kW), and provides precise cutting with a cutting range of 300 mm.

The Disco DFD6450 is a fully automatic dicing saw with parallel dual spindles, designed for dicing and grooving applications on silicon, compound semiconductor wafers, ceramics, glass, and other materials.

The Disco DFD6240 is a fully automatic single-spindle dicing saw for 200 mm wafers, designed for dicing silicon and compound semiconductors and for cutting and grooving ceramics, glasses, and other materials.

The Disco DFD 6350 is an automatic dicing saw described with 6-inch and 8-inch wafer sizes.

The Disco DFL 7160 Laser Dicing is a fully automatic laser saw for Φ300 mm wafers.

The Disco DAD 321 is a wafer dicing saw used for dicing semiconductor wafers.

The Disco DTU 152 is a chiller model manufactured by Disco.

The Disco DFS 8960 Surface Planarization is a fully automatic surface planarization system for 8-inch and 12-inch wafers.

The Disco DGP 8761 is a polishing machine used in semiconductor manufacturing.

The Disco DAD 321 is an automatic dicing saw.

The Disco 3240 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.

The Disco DCS1440 is an automatic cleaning system designed to clean workpieces cut on a dicing saw, supporting a diverse range of workpiece sizes and offering configurable cleaning sequences.