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Tool family

EV Group 40

EV GroupPackaging & Bonding2 entries
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Models in this family

  1. 40 NT
  2. 40 Top-to-Bottom Side Measurement

    The EVG 40 Top-to-Bottom Side Measurement System is a PC-based measurement system for 2-inch to 8-inch wafers and substrates, with a manual alignment stage and 120-230 V, 50/60 Hz power input.

All entries

  1. 40 NTEV Group
    CategoryPackaging & Bonding
    3 specs
  2. 40 Top-to-Bottom Side MeasurementEV Group

    The EVG 40 Top-to-Bottom Side Measurement System is a PC-based measurement system for 2-inch to 8-inch wafers and substrates, with a manual alignment stage and 120-230 V, 50/60 Hz power input.

    6 specs