EV Group

The EVG 301 is a semi-automated single wafer cleaning system for R&D, featuring megasonic cleaning, spinner rotation up to 3000 rpm, and optional pre-bonding and IR-inspection modules.

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

The EVG EV 640 is a mask aligner for 6- and 8-inch wafers.

The EVG EV-420 is a front and backside contact mask aligner used for UV exposure in lithography.

The EVG 301 Cleaning System is a manual wafer loading cleaning system with a camera for bond void inspection.

The EVG 101 Spray Coater is a semi-automatic wafer spray coating system configured for 2-inch to 4-inch wafers.

The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.

The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.

EVG40 is an EV Group top-to-bottom side alignment accuracy measurement inspection system for non-destructive measurement of repeatable alignment accuracy.

The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.

EVG 510 Wafer is a manual wafer load substrate bonder capable of fusion and thermal compression bonding.

The EVG Gemini Automated Production Fusion Bonder is a 300mm bonding system with automated handling, recipe programming, and alignment capabilities.

The EVG 501 Wafer Bonder is a manual wafer-load substrate bonder for 2-inch to 6-inch wafers.

The EVG IQ Mask Aligner is a vintage lithography system described as capable of 6-inch or 8-inch wafers.

EV Group 810LT is a low temperature plasma activation system with 3 process gases, manual wafer loading/unloading, and automated chamber closing/opening.

The EVG 40 Top-to-Bottom Side Measurement System is a PC-based measurement system for 2-inch to 8-inch wafers and substrates, with a manual alignment stage and 120-230 V, 50/60 Hz power input.

The EVG 150 Coater is a spin-on and spray-on coating system with chemistry cabinet, EBR/BSR, multiple pumps, two stations, and heated/chilled plates.

The EVG 540 is a semi-automatic bonder with anodic, fusion, and adhesive bonding capability.

The EVG 420 Mask Aligner is a 6-inch wafer aligner that can only align wafers and has no exposure optics.

The EVG 6200 NT is a semi automated bottom side alignment system with double-side operation and manual handling.